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Past Issues

2008

Solid State Technology
Volume Issue Date
51 12 Dec 01, 2008
51 11 Nov 01, 2008
51 10 Oct 01, 2008
51 9 Sep 01, 2008
51 8 Aug 01, 2008
51 7 Jul 01, 2008
51 6 Jun 01, 2008
51 5 May 01, 2008
51 4 Apr 01, 2008
51 3 Mar 01, 2008
51 2 Feb 01, 2008
51 1 Jan 01, 2008
Microlithography World
Volume Issue Date
17 4 Nov 01, 2008
17 3 Aug 01, 2008
17 2 May 01, 2008
17 1 Feb 01, 2008
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Top Stories

    • The case for leasing equipment
      A ConFab session on "Capital Equipment: Alternative Financing Models" was kicked off by Craig Ignaszewski, director of capital equipment procurement, IBM, with discussion of the rationale for leasing ...
    • Samsung to pay $300M in DOJ DRAM deal
      October 14, 2005 - Samsung Electronics Co. Ltd. has agreed to pay a $300 million fine to the US Department of Justice regarding a single charge related to price-fixing allegations...
    • VLSI: Global tool orders off in April
      Worldwide bookings for semiconductor manufacturing equipment totaled $3.72 billion in April, down 10.6% from March and 34.6% from a year ago, according to VLSI Research Inc.
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Business News

    • TI's Templeton named SEMI's Inoue EHS recipient
      December 4, 2007 - Richard Templeton, president/CEO of Texas Instruments, has been awarded the 2007 Akira Inoue Award from SEMI, for his efforts and achievements in semiconductor industry environmenta ...
    • NXP shuffles mfg execs
      December 4, 2007 - Ajit Manocha, chief manufacturing officer of NXP Semiconductors (nee the chipmaking business of Royal Philips), is leaving the company to return to the US "for personal reasons," th ...
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