Recent Features
- ISMI targets non-product wafer reduction 10/01/2008
- Redefining semiconductor industry R&D 10/01/2008
- Accelerating productivity: key to industry prosperity 10/01/2008
- Accelerating productivity: key to industry prosperity 10/01/2008
- Strategies for energy reduction in semiconductor manufacturing 10/01/2008
Recent Products
- Agile Automation 09/01/2008
- HiPace 09/01/2008
- PE-200-RIE Convertible 09/01/2008
- TEMography Suite 09/01/2008
- PrecisionWoRx VX4 09/01/2008
Tessera files new ITC complaint
Date: April, 2008Apr. 22, 2008 - Tessera Technologies said it has filed a new complaint with the US International Trade Commission (ITC) requesting the body investigate import/sale of certain small-format ball grid array (BGA) semiconductor packages from a quartet of companies: Siliconware Precision Industries Co., Ltd., STATS ChipPAC, Ltd., ASE Inc. and ChipMOS Technologies (plus several affiliates).
The complaint seeks, among other relief, an exclusion order barring the importation, sale for importation or sale after importation of products that infringe Tessera's patents. Tessera filed similar litigation back in 2006.
"We have successfully overcome efforts by the named respondents to avoid an ITC action and believe this is the appropriate forum to stop the importation of their products that use Tessera's technology," said Scot Griffin, Tessera SVP and general counsel, in a statement.


