Recent Features
- ISMI targets non-product wafer reduction 10/01/2008
- Redefining semiconductor industry R&D 10/01/2008
- Accelerating productivity: key to industry prosperity 10/01/2008
- Accelerating productivity: key to industry prosperity 10/01/2008
- Strategies for energy reduction in semiconductor manufacturing 10/01/2008
Recent Products
- Agile Automation 09/01/2008
- HiPace 09/01/2008
- PE-200-RIE Convertible 09/01/2008
- TEMography Suite 09/01/2008
- PrecisionWoRx VX4 09/01/2008
Rohm, Nissan developing high-power chips
Date: April, 2008Apr. 25, 2008 - Electronic parts maker Rohm and carmaker Nissan Motor are codeveloping a high-power semiconductor for use in controlling and converting power in electric cars and other equipment, according to the Nikkei daily.
The SiC semiconductors are made with a new structure developed by Nissan, the paper reports, and also uses polysilicon instead of metal on the chip substrate, allowing the semiconductors to withstand ~10x the electrical pressure of conventional chips.
Samples are already shipping, with Nissan now conducting verification tests; commercial production (no date provided) will be at Rohm's Chikugo plant in Fukuoka Prefecture. Future uses outside of cars include home appliances such as air conditioners and washing machines.
ADVERTISEMENT
Middle


