Solid State Technology Online Article

| Add RSS Feed

Rohm, Nissan developing high-power chips

Apr. 25, 2008 - Electronic parts maker Rohm and carmaker Nissan Motor are codeveloping a high-power semiconductor for use in controlling and converting power in electric cars and other equipment, according to the Nikkei daily.

The SiC semiconductors are made with a new structure developed by Nissan, the paper reports, and also uses polysilicon instead of metal on the chip substrate, allowing the semiconductors to withstand ~10x the electrical pressure of conventional chips.

Samples are already shipping, with Nissan now conducting verification tests; commercial production (no date provided) will be at Rohm's Chikugo plant in Fukuoka Prefecture. Future uses outside of cars include home appliances such as air conditioners and washing machines.




| Add RSS Feed


 
Return to Previous Page

 
Webcasts




How Dual Channel Pulse Testing Simplifies Characterizing RF Transistors
Original broadcast on
March 4, 2008






Atomic Layer Deposition (ALD)
Original broadcast on
October 31, 2007








Process and Metrology Challenges at 65nm and Beyond: Substrates and Strain
Original broadcast on
September 28, 2007







More

Sponsored White Papers Library
Recently Added White Papers

Characterizing New Materials with Electron Microscopy (04/08/2008, FEI Company)

Electrical Nanoprobing with DualBeam™ Systems (04/02/2008, FEI Company)

Site-Specific 3D Characterization of Semiconductor Devices with DualBeam™ Systems (04/02/2008, FEI Company)

Advanced Photolithography for Substrates (10/02/2006, Azores Corp )

Cost-Effective Lithography for Mobile Display Production (10/02/2006, Azores Corp )

More