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- Using combinatorial science to qualify new processes and materials 12/01/2008
- III-V MOSFETs for future CMOS transistor applications 12/01/2008
- High-k etch performance for next-generation logic gate stacks 12/01/2008
- Featured Products 12/01/2008
- Product News 12/01/2008
Recent Products
- Allegheny 12/01/2008
- FPS5300 12/01/2008
- Orion single-wafer cleaning system 12/01/2008
- S300 atomic layer deposition system 12/01/2008
- Twinscan NXTS 12/01/2008
Related White Papers
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New Encapsulated Piezo Actuators for High-Reliability Applications in the Semiconductor Industry
12/01/2008
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Piezo Flexure Nanopositioning Stages and Scanners For Surface Metrology & Nanolithography
12/01/2008
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Sub-Nanometer Precision Hybrid Positioning Systems for Vertical Inspection Tools in Nanotechnology and Semiconductors
12/01/2008
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S/TEM: TrueCrystal Combines With S/TEM Systems For Automated Strain Analysis with Less Stress
12/01/2008
Toray/Samsung JV boosts FPD circuit substrate capacity
Date: April, 2008
Apr. 25, 2008 - A JV between Japan's Toray Industries and Korea's Samsung Electronics is increasing output capacity for film circuit substrates on which FPD chips are mounted. The 55% increase, to 59M units/month, is through a ¥7B facility at Stemco Ltd.'s main plant in Chungcheongbuk-do province, reports the Nikkei Business Daily.
Stemco, which has already ramped the expanded facility into service, is increasing production of film circuit substrates in response to growing demand in both countries, in line with demand for flat-panel displays in TVs, PCs, and LCD panels. Toray holds a 70% ownership stake in the business.
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