Solid State Technology Online Article |  | |
Apr. 28, 2008 - Intel and Cray say they have signed a multiyear deal to develop high-performance computing systems using Intel microprocessors in future Cray systems.
In a statement, the two companies said they plan to explore future supercomputer component designs such as multi-core processing and advanced interconnects, and through the collaboration expect to develop a range of HPC systems and technologies over the next several years.
"We're excited at the potential of bringing together Intel's powerful silicon expertise and Cray's industry leadership in scalable HPC systems," said Peter Ungaro, president/CEO of Cray, in a statement.
"The combination of this industry leadership and technical strength will allow HPC users to take advantage of future Xeon and other Intel processor technologies," added Pat Gelsinger, SVP/GM of Intel's digital enterprise group. "Together we will enable fundamental and historical problems of science and industry to be solved."
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