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- Using combinatorial science to qualify new processes and materials 12/01/2008
- III-V MOSFETs for future CMOS transistor applications 12/01/2008
- High-k etch performance for next-generation logic gate stacks 12/01/2008
- Featured Products 12/01/2008
- Product News 12/01/2008
Recent Products
- Allegheny 12/01/2008
- FPS5300 12/01/2008
- Orion single-wafer cleaning system 12/01/2008
- S300 atomic layer deposition system 12/01/2008
- Twinscan NXTS 12/01/2008
Related White Papers
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New Encapsulated Piezo Actuators for High-Reliability Applications in the Semiconductor Industry
12/01/2008
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Piezo Flexure Nanopositioning Stages and Scanners For Surface Metrology & Nanolithography
12/01/2008
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Sub-Nanometer Precision Hybrid Positioning Systems for Vertical Inspection Tools in Nanotechnology and Semiconductors
12/01/2008
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S/TEM: TrueCrystal Combines With S/TEM Systems For Automated Strain Analysis with Less Stress
12/01/2008
SEMI tips standards for FPDs, MEMS, chips
Date: June, 2008June 25, 2008 - SEMI has published four new technical standards targeting substrate and processes in LCD, MEMS, and semiconductor manufacturing, as part of its triannual standards update.
The new standards include:
- D53-0708: Standards for stand off, transmittance, and strength of pellicle films for FPD masks;
- D52-0708: Simplifying positioning, identification and traceability of larger LCD substrates with 2D code;
- MS7-0708: Describes MEMS microfluidics/microelectronics connection attributes and dimensions; and
- T19-0708: Specs for an identification-code system for bare die up to complete assembled devices.
The new standards, part of SEMI's July 2008 publication cycle, join more than 770 standards published by SEMI since its Standards Program was established in 1973.
