32nm front- and backside wafer inspection

These two tools for wafer edge (E30) and backside inspection (B30) provide improved sensitivity and high throughput for inspection and in-line monitoring of 32nm FEOL and BEOL manufacturing processes. Both use image-based inspection vs. light scattering techniques for enhanced accuracy in sizing, locating, and classifying defects. The E30’s improved darkfield capability increases sensitivity to 2µm on patterned production wafers; on the backside, new optics improve backside defect sensitivity to 3µm. A redesigned wafer handler reduces handler-induced film delamination by avoiding contact with complex film stacks. Boosted onboard computing power can accommodate future algorithms. Both tools can be housed in a single cabinet. Rudolph Technologies Inc., Bloomington, MN; ph 952/820.0080, www.rudolphtech.com.

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Deposition systems for CIGS

The FastFlex line of web coating systems targets production of flexible thin-film CIGS solar cells, offering a high quantity of deposition zones in a compact footprint. The platform incorporates three systems: one for reactive sputtering of transparent conductive oxide (TCO), one for metal sputtering deposition (Molybdenum layer), and one for the CIGS layer. The system can process web widths up to 350mm and supports widths of 1m or more for metal as well as polyimide substrates. A flexible architecture offers a choice of rotary or planar magnetron cathode assemblies, loading, and maintenance requirements. Veeco Instruments Inc., Plainview, NY; ph 516/677.0200, www.veeco.com.

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AFM eliminates scanner ‘bowing’

Park Systems’ XE-Wafer is a fully automated atomic force microscope (AFM) system for wafer inspection and metrology, addressing surface roughness, trench width, depth, and angle measurements on 200mm and 300mm wafers in a production environment. A decoupled XY and Z scanner eliminates bowing inherent in other conventional AFMs. The high-force Z-scanner allows a 10X larger bandwidth than conventional scanners, enabling non-contact scan. Automation and application-specific software includes pattern recognition and automatic sample navigation capabilities for automated analysis of batch samples. Park Systems Inc., Santa Clara, CA; ph 408/986.1110, www.parkafm.com.

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Wafer bonding for CIS

Suss MicroTec’s XBC300 production wafer bonder is designed for 300mm wafer bonding in CMOS image sensor integration and packaging. The cluster tool utilizes a patented dual-wafer single-station bond technology to enable 300mm cleaning, aligning, and bonding within a single process module. Fusion bonds include 3D stacking with Cu-Cu (<10nm vias), polymer bonds, and hybrid bonding; adhesive processes include BCB, polyimide, or epoxy. Suss MicroTec, Waterbury Center, VT; ph 802/244.5181, www.suss.com.