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New Encapsulated Piezo Actuators for High-Reliability Applications in the Semiconductor Industry
12/01/2008
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Piezo Flexure Nanopositioning Stages and Scanners For Surface Metrology & Nanolithography
12/01/2008
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Sub-Nanometer Precision Hybrid Positioning Systems for Vertical Inspection Tools in Nanotechnology and Semiconductors
12/01/2008
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S/TEM: TrueCrystal Combines With S/TEM Systems For Automated Strain Analysis with Less Stress
12/01/2008
Accelerating productivity: key to industry prosperity
ISMI ? it’s all about productivity: increasing output and decreasing costs. It’s where the rubber meets the road, where R&D meets manufacturing, as you’ll see in this special issue of Solid State Technology. ISMI’s program portfolio covers the spectrum from fundamental cost reduction activities in today’s fabs and the development of near-term enabling infrastructure, to the long-term transition to next-generation fabs. Collectively, ISMI’s collaborative programs contribute to the manufacturing success of our member companies, and provide valuable insight into the priorities of our industry and its leading chipmakers.
Some keywords for ISMI activities are time, energy, data, performance, cycle time, information, and productivity. Time is important not only for our productivity improvement objectives at a high level, but also for optimal performance of our manufacturing fabs. In that context, the very data used to manage and control our fabs must be synchronized with accurate timekeeping across hundreds of production equipment types and thousands of wafers. In fact, millisecond resolution is required in some cases.
Energy conservation impacts all of our lives worldwide. As manufacturers, we care deeply about our environment, and about our budgets. ISMI member fabs are acutely focused on energy reduction, with an urgency that is driven by cost-saving opportunities as well as a strong desire to minimize the environmental footprint of our factories.
Cycle time is a key success factor for manufacturing operations, and ISMI member companies want to reduce cycle time by 50% in their fabs. Our Next Generation Fab (NGF) program is dedicated to this important goal.
At ISMI, we believe reducing costs and increasing productivity is critical for the long-term prosperity of our industry. We are determined to succeed in accelerating manufacturing productivity through the creative collaboration of manufacturing experts from around the globe. It’s an exciting and rewarding endeavor! ¦
Scott Kramer,
Vice President of Manufacturing Technology,
International SEMATECH Manufacturing Initiative
Three years, two months to 2012
We’re pleased to be bringing you this special issue, the result of a collaborative effort between ISMI and Solid State Technology, initiated last year. Of all the topics addressed, perhaps none are as controversial as the move to 450mm wafer sizes in the 2012 timeframe, just a little more than three years away.
I salute Scott and his colleagues at ISMI for their efforts in this regard, and for their ability to tread what I imagine is sometimes a fine line in trying to fulfill the needs of diverse member companies, each with different goals and strategies. Proponents of 450mm would like to see a pilot line established by 2012. Others say?some quite adamantly?that the semiconductor industry should focus its limited resources on improving the efficiency of existing factories (typically labeled as 300Prime or NGF efforts).
As you’ll see, work on 450mm is already well underway at ISMI, as is work to improve 300 mm fab efficiency. What struck me as I read the various articles in this issue is that these are not competing technologies. Just the opposite: one goal of the 450mm program is to apply the efficiency lessons learned?and still being learned?through the NGF program.
Another common theme through this issue is that these efforts require a high level of involvement from the equipment and materials supplier community. “Early engagement with the industry and suppliers has been a lesson learned from 300mm and a focus of the 450mm program, along with analysis of ESH challenges and the drive towards “green”manufacturing,”notes Tom Abell in his 450mm update. Similarly, Olaf Rothe and co-authors say an important ISMI effort is the outgoing message to the supplier community identifying the types of changes and improvements that are necessary to support the success of the NGF.
So read on and enjoy this special issue. Thanks to all at ISMI that made it possible, best wishes for continued success and I hope you can all make the ISMI Manufacturing Week Conference, to be held October 24-27, 2008 in Austin, Texas. ¦
Pete Singer
Editor-in-Chief


