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Mentor Graphics + Ponte: "End of the DFM dream"

by James Montgomery, News Editor, Solid State Technology
May 15, 2008 - The acquisition of Ponte Solutions by Mentor Graphics not only takes one of the last pure DFM companies off the table, it also answers the question about what side of the chipmaking wall DFM belongs, and terminates an inflection point that might not be seen again for a decade or more.

Current Issues, Newsletters and Resource Guides

SST

MLW

Tech Talk

SunPower, Heliovolt tout record efficiencies
(May 12 2008)

Princeton tips way to "melt" chip features
(May 5 2008)

TSMC announces entry into MEMS market
(May 5 2008)

Fujitsu tips method for estimating soft errors due to "cosmic rays"
(April 30 2008)

Spansion, IBM ink memory license pact
(April 29 2008)

Suss, Philips developing new nanoimprint tech
(April 29 2008)

IBM, Matheson to develop ≤32nm chip gases
(April 29 2008)

Intel, Cray to develop supercomputer chips
(April 28 2008)

Around the industry

Reports: China quake affects few chip firms
(May 14 2008)

AMAT tips SunFab service plan
(May 12 2008)

Report: China wooing 300mm fabs from Taiwan
(May 12 2008)

Hynix, ProMOS deepening tech partnership, add ownership stake
(May 8 2008)

Qualcomm, Foxlink expanding MEMS work
(May 8 2008)

DuPont expanding in China to chase PV growth
(May 7 2008)

SEMI: Wafer shipments flat in 1Q08
(May 7 2008)

Analyst: Big 4 still rule foundry roost, but Samsung moving up
(May 6 2008)

From The Wires

Rudolph announces new Wafer ... Business Wire (May 15, 2008)	Mentor Graphics acquires ... Business Wire (May 15, 2008)
MagnaChip enters agreements ... PR Newswire (May 15, 2008)	Intel, SMIC Chengdu chip ... Asiaport Daily News (May 15, 2008)
BROKERWATCH: Wacker Chemie ... AFX News Limited (May 15, 2008)	Putting more juice in solar The Atlanta Journal-Constitution (May 15, 2008)
Synopsys, TSMC collaborate ... PR Newswire (May 14, 2008)	TI acquires Commergy Technologies M2 Communications (May 14, 2008)

From the Current Issue

Despite engineering and cost challenges, 32nm node IC manufacturing within reach		System-in-package integration of passives using 3D through-silicon vias
Fully gate-all-around silicon nanowire CMOS devices		Lithography’s future: tougher than ever
Business Trends		Etching new IC materials at 32nm and 22nm
Submicron micromachining technology for liquid phase chromatography separation		Product News

Products

Wafer News Financials

Equip. / Mat.

Chipmakers

NYSE

Wafernews Equipment/Materials

325.92 +3.01 (+0.93%)

Index	Price	Change (%)
Equip. / Mat.	325.92	+3.01 (+0.93%)
Chipmakers	136.91	+3.37 (+2.53%)
NYSE	9553.52	+116.07 (+1.23%)
NSDQ	2533.73	+37.03 (+1.48%)
S&P 500	1423.57	+14.91 (+1.06%)

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QuickVote

The US government is handing out "economic stimulus payments" hoping to spur consumer spending and boost the flagging economy. So how will you spend your check?

Videocasts

2008 SPIE Advanced Lithography Conference: SST On the Scene video interviews

DFM Segment
Letting down the guard - propagating design intent; impact of double patterning immersion lithography; challenges at 32nm and 22nm

Lithography technology segment
Extendibility of immersion litho; double patterning and double exposure; readiness of EUV; viability of NIL?

SEMICON West 2007:SST On the Scene video interviews
July 22, 2007

Praxair Electronics Technology Forum
Convergence in going from 45nm to 32nm?
Don’t even think about it!
The evening’s theme may have been Zen-like - enlightenment and sharing knowledge - but the presenters and panelists at the Praxair Electronics Technology Forum zeroed in on areas of contention facing IC manufacturers as they go from 45nm to 32nm. IC manufacturers are pursuing multiple, and sometimes divergent, solutions for controlling process variability, high-k/metal gates, and annealing. Debra Vogler, Sr. Technical Editor, was on hand to cover the event and interview presenters and panelists for Solid State Technology’s video interview program, SST On the Scene.

AMD Segment
Unresolved metrology issues at 45nm…challenges at 32nm…AMD goes lean

Webcasts

How Dual Channel Pulse Testing Simplifies Characterizing RF Transistors
Original broadcast on
March 4, 2008

Atomic Layer Deposition (ALD)
Original broadcast on
October 31, 2007

Process and Metrology Challenges at 65nm and Beyond: Substrates and Strain
Original broadcast on
September 28, 2007

Sponsored White Papers Library

Recently Added White Papers

Characterizing New Materials with Electron Microscopy (04/08/2008, FEI Company)

Electrical Nanoprobing with DualBeam™ Systems (04/02/2008, FEI Company)

Site-Specific 3D Characterization of Semiconductor Devices with DualBeam™ Systems (04/02/2008, FEI Company)

Advanced Photolithography for Substrates (10/02/2006, Azores Corp )

Cost-Effective Lithography for Mobile Display Production (10/02/2006, Azores Corp )

Upcoming Events

The ConFab May 18 -21, 2008 Las Vegas, NV United States

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