Allegheny
Presto Engineering
Thermal control for in-Si analysis
The Allegheny is a moveable diamond heat spreader for delivering precise thermal control. Temperature characterization range is -65°C to +125°C, with the ability to handle devices dissipating >300W without liquid or water cooling. It is compatible with most commercial failure analysis equipment, including emission and laser microscopes, laser voltage probers, and mechanical probers; it can be installed in most state-of-the-art backside in-silicon analysis systems and enables imaging with air-gap and immersion lenses. Presto Engineering, San Jose, CA; ph 408/434.1808, www.presto-eng.com.
FPS5300
Micronic Laser Systems
Photomask pattern generator
The FPS5300 is based on Micronic’s pattern generators for display photomasks, adapted for a wide range of sizes and feature resolutions. A new submicron writing level addresses more photomask applications with high resolution and image control. Switching between writing levels is fully automated. In standard configuration, the FPS5300 writes substrates up to 813mm × 813mm; an extended size option increases to 1100mm2. Throughput ranges from 260mm2/min (0.µm minimum lines/spaces, 60nm linewidth uniformity, 200nm overlay) to 12,000mm2/min (6µm lines/spaces, 250nm uniformity, 500nm overlay). Micronic Laser Systems, Täby, Sweden; ph +46/8.638.5200, www.micronic.se.
Orion single-wafer cleaning system
FSI International
Single-wafer cleaning system
The Orion single-wafer cleaning system has a unique closed-chamber design that the company says addresses several cleaning-related issues in 32nm and 22nm manufacturing, notably reduction of material loss during photoresist stripping after ultrashallow implants, and the elimination of material loss and galvanic corrosion in high-k metal gates and copper interconnects with metal-containing capping layers. The catalyst together with a process temperature >20-50% higher than standard wet bench processes temperature enable a reaction rate 4000x faster than the reaction rate of standard all-wet photoresist stripping processes. A spray bar gives greater wafer coverage than a single point nozzle with more efficient chemical and water usage. The tool’s design accommodates multiple chamber types and permits the addition of modules. FSI International, Chaska, MN; ph 952/448.5440, www.fsi-intl.com.
See Debra Vogler’s analysis of the FSI Orion at www.solid-state.com.
S300 atomic layer deposition system
Cambridge NanoTech
300mm ALD system
The S300 atomic layer deposition system extends the company’s line of ALD tools to handling substrates up to 300mm in size. Like its predecessors (S100/S200), it offers configurations of up to six precursor lines and a compact ozone generator, with an optional “ALD Booster” for low vapor pressure precursors, higher-temperature ALD valves (>200°C), and up to three gas MFCs. An ALD Shield allows excess reactive vapors to form a film before they make it to the pumping system, thus preventing build-up of deposits on the plumbing and in the pump; the shield’s high-conductance, hot-foil design causes gases to deposit until depleted. Cambridge NanoTech, Cambridge, MA; ph 617/674.8800, www.cambridgenanotech.com.
Twinscan NXTS
ASML
Enhanced litho scanner
The Twinscan NXTS features a new planar wafer stage design that incorporates new materials to reduce weight by 66% vs. previous generation Twinscan systems; a new positioning measurement system improves overlay improvement by 50%. Vertical interferometers measure placement of the stage relative to an overhead grid plate, resulting in a much shorter light path and reducing the impact of air turbulence. Throughput is improved by ˜30% thanks largely to new autonomous, magnetically levitated stage platforms that allow immersion fluid to move from one to the other, reducing resistance to acceleration/deceleration and lowering swap times. ASML, Veldhoven, The Netherlands; ph +31/40.268.3000, www.asml.com.
See Katherine Derbyshire’s analysis of the Twinscan NXT at www.solid-state.com.
WDF 12DP
Tokyo Electron America
Dual-purpose 300mm dicing frame prober
The WDF 12DP is designed to address increased demand for probing ultrathin and diced wafers, and wafer-level testing of chip-scale and wafer-level packaging, stacked, and 3D technologies, as well as KGD testing of ultrathin wafers, singulated wafers, and strips on a dicing frame. It employs on-axis alignment and N-shot alignment, offering “superior” accuracy and the ability to test in parallel. The system can also be used as a standard wafer prober. Tokyo Electron America, Austin, TX; ph 512/424.1000, www.ph.com.
X-Max silicon drift detector
Oxford Instruments
Silicon drift detector
The X-Max silicon drift detector provides a large area detector over 10x the solid angle of conventional EDS detectors, translating into 10× faster data gathering and at 10× lower beam currents. Sizes range from 20mm2 up to 80mm2; resolution is down to 123eV with throughput “far in excess” of 100,000 counts/sec. Oxford Instruments, Concord, MA; ph 978/369.9933, www.oxinst.com.
Sharkskin
Morgan Technical
Better adhesion for solar, laser apps
The Sharkskin aims to improve process residue adhesion through highly controlled texturing of ceramic component surfaces, replacing traditional methods of roughening via grit blasting or twin-wire arc sprays. Two-fold adhesion improvement is achieved over arc-plasma -spray ceramic films, at roughnesses up to 1200µ" Ra. Morgan Technical Ceramics, Fairfield, NJ; ph 800/433.0638, www.morganplc.com.
AltaCVD
Altatech
ALD, CVD in one tool
The AltaCVD targets plasma-enhanced MOCVD and ALD processes of a wide range of materials used in logic and memory devices, as well as in microsystems and 3D integration. It encompasses both chemical vapor deposition (CVD) and atomic layer deposition (ALD) through a unique vaporizing technology, chamber design, and gas/liquid panel to deposit new, viscous, and nonvolatile precursors. A proprietary reactor design and precursor introduction path with a pulsed liquid injection and vaporization enables nanoscale control of thickness, uniformity, composition, and stoichiometry. Altatech, Grenoble-Montbonnot, France; ph +33/456.526.800, www.altatech-sc.com.
Candela 7100
KLA-Tencor Corp.
Defect inspection for HDDs
The Candela 7100 series for advanced defect inspection and classification of hard disk drive substrates and media (both metal and glass) incorporates a new dual-wavelength laser configuration, which is optimized for higher sensitivity, flexibility in application recipe settings for layer-based power modes, and improved laser output and stability. Multiple independent scatter detectors enable detection and classification of sub-micron defects (pits, bumps, particles, buried defects). Improved phase, specular, and magnetic channels offer improved sensitivity and stability for capturing stains and imaging advanced perpendicular magnetic recording (PMR) surfaces. KLA-Tencor Corp., Milpitas, CA; ph 408/875.3000, www.kla-tencor.com.
MA/BA8 mask/bond
Suss MicroTec
6-in-1 mask alignment/bonding
The third generation of the MA/BA8 mask/bond aligner offers submicron alignment (down to 0.25µm) and exposure optics dedicated for thick resist exposure, upgradeable to emerging technologies such as UV (NIL, SCIL) and microlens imprinting (SMILE), UV-bonding, and enhanced bond alignment. It also offers shadow mask alignment for evaporation applications, and a near-field holography module for producing diffractive gratings down to 100nm. Processes developed on the MA/BA8 Gen3 can be quickly transferred onto an automated Suss mask aligner for high-volume production, which is based on the same technology. Suss MicroTec, Garching, Germany; ph +49/893.2007.395, www.suss.com.
ACuPLANE
Rohm and Haas Electronic Materials
Tunable Cu CMP system
The ACuPLANE copper barrier CMP system for advanced Cu/low-k interconnect applications combines Rohm and Haas’s EcoVision 4000 CMP Pad and ACuPLANE 5000 Series slurries. This tunable CMP system offers <5% within-wafer and within-die nonuniformity, and “extremely low” defectivity when used with the company’s Politex and VisionPad products. The company says customer tests indicate 2-3× extension of average pad life. Rohm and Haas Electronic Materials, CMP Technologies, Newark, DE; ph 302/366.0500, www.rohmhaas.com.
ChemLogic
DOD Technologies Inc.
Gas monitoring system
The ChemLogic 96 point continuous monitor provides quick detection of low-level toxic and corrosive gases. Features include new intelligent optics and an optimized flow system. Gases detected include a variety of hydrides (AsH3, PH3, B2H6, GeH4, SiH4, H2Se, and H2S) and mineral acids (HDL, HF, BF3, and HBR), as well as ammonia, chlorine, and phosgene. Use of 1/4” tubing allows for easy upgrades of other obsolete sample draw systems. DOD Technologies Inc., Crystal Lake, IL; ph 815/788.5200, www.dodtec.com.
S2012PV
Viscom AG
AOI for solar cells
The S2012PV automated optical inspection system targets solar cell production, including wafer material control, cell characterization, and cell control (i.e., geometry, print image, cracks, color, micro cracks). Interlinked matrix cameras enable various resolutions (48, 37. or 34µm/pixel). A specially developed calibration concept ensures genuine measurement accuracy and sustained reproducibility for all inspection tasks. The image field is large enough for standard 156 × 156mm (6.1” x 6.1”) wafers. Viscom AG, Hanover, Germany; ph +49/511.949.960, www.viscom.com.
SD1024FH
Verity Instruments Inc.
Spectrograph for etch control
The SD1024FH spectrograph is designed for demanding semiconductor process control applications such as very low exposed area contact etch, ion beam etch, and photomask etch. Features include a 200-800nm spectral range optical system with a 1024-element thermoelectrically cooled CCD sensor, optimized UV response, resolution <2nm, signal/noise ratio of >1000 at full scale, and 7msec readout time. Verity Instruments Inc., Carrollton, TX; ph 972/446.9990, www.verityinst.com.
TREK
Trek Inc.
ESD monitoring
The TREK model 875 electrostatic voltage sensor is designed for in-line monitoring of electrostatic charge build-up on production lines and other manufacturing process. An automatic calibration technique maintains high accuracy and speed over wide variations of spacing between the non-contacting measurement probe and the surface under test. Features include a voltage measurement range of ± 500V DC or peak AC, accuracy of ±0.5%, speed of 25msec, and low noise of 2.5% of full scale. Buffered output voltage and current monitors (4-20mA) are provided for remote monitoring and alarm purposes. Trek Inc., Medina, NY; ph 585/798.3140, www.trekinc.com.
compact ceramic piezo motors & actuators
Physik Instrumente
Precision Actuator Catalog
PI’s new line of compact ceramic piezo motors & actuators replaces classical actuators & motion control components. Advantages: no lubricants, high-speed, millisecond responsiveness, vacuum compatible, non-magnetic. Zero-wear flexure designs available. Applications: Lithography, optics & imaging, nanotechnology, high magnetic fields, vacuum, fast pumps, scanning microscopy, OCT, MRI.
PI (Physik Instrumente) L.P.
16 Albert St., Auburn, MA, 01501
T: 508.832.3456
www.pi-usa.us
info@pi-usa.us
Agile Automation
Asyst Technologies Inc.
Automated material handling
Agile Automation is a new approach to automated material handling in semiconductor fabs. It enables increases in fab productivity through modular enhancements to the existing AMHS system and can load and unload several tools in parallel while reducing dependency on OHT vehicles. The unit integrates with standard factory automation systems in existing or Greenfield environments. Agile Automation is the result of the integration of the company’s hardware, software, and services capabilities, and permits customizable applications that seamlessly integrate within the Fab environment via standard industry interfaces. The company is integrating several new technologies as part of the Agile Automation offering, including DLT Lifting Loadport for OHT-independent tool loading. Other new technologies and products include Satellite Stocker, which provides near-tool buffering; the Velocity HTC conveyor for high-speed, high-throughput material handling in both inter-bay and intra-bay applications; and new VAO software, which allows real-time visualization of fab processes and material flow. Asyst Technologies Inc., Fremont, CA USA; ph 510/661-5000, www.asyst.com.
HiPace
Pfeiffer Vacuum Inc.
Turbopumps
HiPace, an expanded line of compact turbopumps, comes in pumping speeds that range from 1000 to 2000 liters/second. The pumps feature a new rotor design that reduces run-up time by 50% and provides high gas throughput for light and heavy gases, claims the company. The use of aluminum housing and innovative materials reportedly makes this turbopump 40% lighter in weight and doubles the service life to five years between bearing changes. HiPace is available in both standard and corrosive models. The integrated drive electronics reduces the need for bulky cabling. In addition to semiconductor applications, the turbopumps are suitable for photovoltaic coating, industrial applications such as brazing furnaces, general sputter coating, and coating of architectural glass and ophthalmic lenses. Pfeiffer Vacuum Inc., Nashua, NH USA; ph 603/578-6500, www.pfeiffer-vacuum.com.
PE-200-RIE Convertible
Plasma Etch Inc.
Anisotropic etching system
The PE-200-RIE Convertible is suitable for anisotropic etching of nitrides, oxides, and polyimides. The system has a 13”×13” water-cooled RIE electrode for substrate processing as well as a movable parallel plate ground electrode on a unique shelving assembly so that the distance between the powered electrode to the ground can be varied by half-inch increments. Three 13”×13” electrodes with 3-inch fixed spacing is provided to place parts for uniform plasma cleaning/etching. The system includes a 300W 13.56MHz RF power supply with automatic matching, as well as two mass flow controllers. The unit is completely PLC-controlled using a six-inch touch screen display for user configuration setup and operation. Plasma Etch Inc., Carson City, NV USA; ph 775/883-1336, www.plasmaetch.com.
TEMography Suite
JEOL USA Inc.
Software packages
The TEMography Suite software package automates data acquisition, 3D reconstruction, and visualization on the company’s TEMs. TEMography allows cross sectional and 360° observation at any tilt angle. Automated alignment algorithms allow the operator to specify a reconstruction range after image acquisition, which eliminates the need to photograph the same sample (see photo of sample capture) more than once. The Automated Data Acquisition System (JADAS) software, which was developed in collaboration with the NCMI, Baylor College of Medicine, automates data acquisition for cryoelectron microscopy. JADAS gives researchers the flexibility to customize imaging parameters for ice-embedded macro-molecular complexes under low dose conditions. JEOL USA Inc., Peabody, MA USA; Ph 978/535-5900, www.jeol.com.
PrecisionWoRx VX4
Rudolph Technologies
Probe test card
The PrecisionWoRx VX4 is the next generation of the company’s probe card test and analysis tools. The system, which will replace the PrecisionPoint VX3, adds configurable channels, higher loading forces, a user interface and software architecture consistent with other WoRx family tools, and a current-generation operating system (Windows XP or Vista). The new VX4 is scheduled for release in the first half of 2009. The system features load forces up to 150kg and will accommodate newer probe cards with high pin counts. The unit allows semiconductor manufacturers to evaluate and correct the planarity, alignment, contact resistance, leakage current, probe force, tip wear, scrub characteristics, and numerous other critical probe card parameters that impact probing process performance. Rudolph Technologies, Flanders, NJ USA; ph 973/691-1300, www.rudolphtech.com.
Solamet PV159
DuPont Microcircuit Materials;
Metallization paste
Solamet PV159 thick-film metallization paste for frontside PV solar cell metallization purportedly has a favorable environmental profile, as it is made without cadmium as an ingredient. The newly developed chemistry in the paste is being used as the basis for a range of materials characterized by varying degrees of chemical reactivity, enabling solar cell manufacturers to more exactly match the material to their specific process conditions. Solamet PV159 is compatible with the most recently released Silver Tabbing material, Solamet PV505, that delivers high adhesion, low laydown, and low contact resistance, according to the company. DuPont Microcircuit Materials; ph 800/284-3382, mcm.dupont.com.
ashable hard mask
Novellus Systems Inc.
Ashable hard mask process technology
An ashable hard mask (AHM) process configuration serves the company’s VECTOR Extreme PECVD platform. As configured on the VECTOR Extreme, the AHM technology employs an RF power configuration, optimized process gas chemistry, and integrated post-deposition edge bevel film removal (EBR). The VECTOR Extreme AHM system is capable of providing memory manufacturers throughputs in excess of 150 wafers per hour, claims the company. Novellus Systems Inc., San Jose, CA USA; ph 408/943-9700, www.novellus.com.
ALTUS Max
Novellus Systems Inc.
Pulsed nucleation layer tungsten deposition platform
The ALTUS Max, the latest enhancement to the company’s pulsed nucleation layer (PNL) tungsten deposition platform, targets high-volume memory megafabs. The system reportedly uses the latest technology and advanced processing capability to provide tungsten films that meet or exceed 20nm memory requirements for fill, resistivity, roughness, and defects. The company claims it is the first atomic layer deposition tungsten system to break the 120WPH throughput barrier. The system employs SwiftTrak wafer handling for improved throughput and reliability. In addition, the new ALTUS Max Multi-Thickness Recipe management system, in which wafers of different film thicknesses can be processed simultaneously within the same chamber, further improves the system efficiency. The system will be available for volume shipment beginning in Q4 2008. Novellus Systems Inc., San Jose, CA USA; ph 408/943-9700, www.novellus.com.
Hi-Res
Sonoscan Inc.
Hi-res generation
The HiRes Generation THRU-Scan enhances through-transmission imaging with the company’s C-SAM line of acoustic microscopes. Reflection-mode acoustic imaging (the most frequently used mode) is limited to a defined depth within a sample, but THRU-Scan images the whole thickness in one scan, according to the company. For example, a plastic-encapsulated microcircuit might have five layers. Reflection-mode imaging typically selects one or two internal interfaces to image for anomalies or defects. But THRU-Scan images the whole thickness of the part—all five layers and all four interfaces—simultaneously, and reveals a defect or anomaly at any depth. Often THRU-Scan is used along with reflection-mode imaging to simultaneously verify the x-y location of a defect and specify its depth. Sonoscan Inc., Elk Grove Village, IL USA; ph 847/437-6400, www.sonoscan.com.
Kiyo3x
Lam Research
Conductor etch series
Kiyo3x delivers CD uniformity of 1nm, 3-sigma variation, enabling advanced applications such as double patterning. Its field-upgradable options provide a flexible approach for addressing high- k/metal gate, hardmask open, shallow trench isolation, and strained silicon. The new Kiyo3x series includes improvements in wafer temperature control that enable radial tuning for edge control and profile shaping. For complex film stacks such as high- k/metal gate, the system provides multi-film etch capability in a single chamber, which results in a 50% to 100% productivity advantage over a two-chamber approach, claims the company. Lam Research, Fremont, CA USA; ph 510/572-0200, www.lamresearch.com.
Sirius 6000 abatement system
Edwards Vacuum
Microwave plasma abatement system
The Sirius 6000 abatement system addresses greenhouse gas abatement challenges arising from dielectric and polysilicon etch processes used in semiconductor manufacturing. The company claims the unit uses an energy-efficient microwave plasma in a carefully controlled chemical environment and an integrated wet scrubber to reduce fab greenhouse gas emissions by as much as 95% over a range of total flow rates and perfluorocompound (PFC) concentrations. The plasma reduces PFC gases to hydrogen fluoride (HF) and prevents the creation of harmful by-products, such as carbon tetrafluoride. The hydrofluoric acid and any other remaining by-products are then removed from the exhaust stream in the integrated wet scrubber, preventing harmful emissions from reaching the atmosphere. The system is already deployed and in operation at select customer fabs in Asia and Europe. Edwards Vacuum, Crawley, West Sussex, UK; ph +44 (0) 8459 21 22 23, www.edwardsvacuum.com.
Applied E3
Applied Materials
Process and control software package
Applied E3 is a factory automation (FA) software package for improving the productivity of semiconductor, flat panel display, and photovoltaic solar cell manufacturing. According to the company, the Applied E3 system can boost process capability by >30%, reduce unscheduled downtime, and shorten cycle time to achieve up to a 20% increase in overall equipment effectiveness. Using scalable software architecture, the Applied E3 provides a combination of modules, including those for equipment automation, data collection, and logic handling, which simplify the construction, deployment, and maintenance of automated process control (APC) applications. Applied Materials, Santa Clara, CA USA; ph 408/727-5555, www.appliedmaterials.com.
CN6201 temperature/process controller
Omega Engineering Inc.
Temperature/process controllers
This series of temperature/process controllers has one program pattern consisting of 16 segments. The front panel of the CN6201 temperature/process controller features a dual display and has a splash-proof and dust-proof design. The universal input supports thermocouple, RTD, and voltage input types. Options include dual alarms, retransmission output, and RS-485 communications interface. Recommended applications are heat treating, water baths, industrial oven control, and any process control application. The CN6201 series comes with a two-year warranty, and pricing starts at $285. Omega Engineering Inc., Stamford, CT USA; ph 203/359-1660, www.omega.com.
Gas Lifetime eXtension (GLX2) control system
Cymer Inc.
Gas lifetime control system
The Gas Lifetime eXtension (GLX2) control system (second-generation) for the XLA and XLR series of light sources extends the maximum time between light source gas exchanges from one billion pulses to two billion pulses, and reduces downtime associated with gas refills by a factor of 20, compared with non-GLX systems, according to the company. GLX installations show improved bandwidth stability trends over e?xtended gas lifetimes, enabling chipmakers to better meet their critical dimension (CD) control requirements. Cymer Inc., San Diego, CA USA; ph 858/385-7300, www.cymer.com.
IMPULSE 300mm
Nanometrics Inc.
Integrated metrology system
The IMPULSE 300mm real-time integrated metrology (IM) system is used to monitor vital CMP, CVD, etch, and photolithography process applications for 32nm nodes and beyond. Following the company’s 9000 and 9010 IM systems, the IMPULSE incorporates new innovations in mechano-optical design and algorithms, allowing up to 70% higher throughput over previous-generation systems and 3× tighter process control windows, claims the company. The IMPULSE IM module also provides plug-and-play connectivity with the company’s high-end Atlas XP stand-alone metrology systems through its NanoNet connectivity solution. Nanometrics Inc., Milpitas, CA USA; ph 408/545-6000, www.nanometrics.com.
Kalrez 8900 perfluoroelastomer
DuPont Performance Elastomers
Perfluoroelastomer parts for semiconductor thermal processes
Kalrez 8900 perfluoroelastomer parts for semiconductor thermal processes feature longer seal life in higher-temperature semiconductor manufacturing processes, claims the company. The parts are for static and dynamic sealing applications in thermal processes such as oxidation, diffusion furnace, metal CVD, ALD, and LPCVD. Kalrez 8900 parts reportedly have excellent thermal stability with maximum continuous service temperature of 325°C, very low outgassing properties, and excellent response to temperature cycling effects. Suggested applications include quartz tube seals, plenum seals, chamber seals, and center ring seals. DuPont Performance Elastomers, Wilmington, DE USA; ph 302/792-4000, www.dupontelastomers.com.
Model 5800 dual-beam laser
ESI Inc.
Micromaching system
Model 5800 dual-beam laser system micromachines very high-quality micro features in semiconductor, metallic, solar, ceramic, and glass applications. The unit incorporates two high-power fiber lasers specifically designed for industrial use. By utilizing the patented Compound Beam Positioner with seven axes of coordinated motion control, there is no stepping time and no abutment errors involved during machining, claims the company. The Model 5800 system comes with programmable spacing between the two beams, which results in optimal machining speed. The combined effect of the high-power fiber laser and field-proven compound beam positioner provides maximum flexibility. ESI Inc., Portland, OR USA; ph 503/641-4141, www.esi.com.
NB-180
Novomer
Clean-burning binder for advanced industrial applications
NB-180, a poly(propylene carbonate) (PPC) sacrificial binder, is an amorphous, colorless thermoplastic polymer that degrades completely and uniformly into environmentally benign products, making it suitable for high-performance applications, particularly in the precise assembly of micro- and nano-scale devices. The company claims NB-180 burns cleaner than competitive products and also decomposes more predictably at temperatures that are much lower than currently available products. Complete burnout occurs by 300°C in inert atmospheres such as nitrogen, argon, and hydrogen. NB-180, the company’s first product, can be produced in customized viscosities and molecular weights to meet specific solution requirements. Pricing varies based on formulation and quantity ordered and is available upon request. Novomer, Ithaca, NY USA; ph 607/330.2321, www.novomer.com.
NanoScan
NexTech FAS
Automated optical inspection (AOI) technology
NanoScan automated optical inspection (AOI) technology employs highly accurate and sensitive detection of problem-causing particles and pattern defects during FPD manufacture, providing submicron particle inspection for the company’s AOI platforms. Through the use of NanoScan-enabled equipment, such as the company’s NexTStar and the FPDStar, manufacturers can identify and map particle and pattern defects in the active matrix display as well as defects in the intricate circuits surrounding the active matrix. This can all be accomplished on a single platform and at resolutions as small as 300nm, claims the company. The technology will be used primarily within the FPD industry and will be focused on the emerging OLED technology of both glass and flexible substrates. The technology will also be used for TFT/LCD displays, touch-screen substrates, and solar panels. NexTech FAS, Austin, TX USA; ph 512/833-0740, www.nextechfas.com.
OSP-300
WaferMasters Inc
OSP system and Raman spectrometer
The OSP-300 laser-based optical surface profilometer system provides inline non- contact surface profile characterization of blanket and device wafers between process steps for R&D and manufacturing applications. The company claims the system provides local surface profile information that can be used to identify process anomalies that other surface profiling tools might miss. The data is plotted in a “visually intuitive” format, which gives wafer flatness, curvature, contour maps, and vector plots that can be compared to baseline data to reveal reproducibility issues. The scan sensitivity designed into this tool reveals local distortion as well as global warpage, twist, distortion, and pattern rotation. The MRS-300 Multi-Wavelength Raman Spectroscopy System allows non-destructive wafer characterization of local lattice strain and crystal quality, as well as depth profiling for evaluation or product wafers. It can also be used as a non-contact, non-destructive Ge content characterization tool for strained Si technology. WaferMasters Inc., San Jose, CA USA; ph 408/451-0850, www.wafermasters.com.
PV-5000 laser workstation
J. P. Sercel Associates
Laser workstations
PV-5000 laser workstation processes solar thin film photovoltaic (PV) products. The company will sell these systems to PV product manufacturers globally, with the first system deliveries scheduled for the fourth quarter of this year. The workstations have the ability to laser machine high-efficiency solar thin-film panels that cost less to manufacture than current silicon-based PV panels, claims the company. The unit is based on the successful ChromaDice DPSS laser platform and is designed for isolation and series interconnection of thin-film solar cells. The laser systems employ high peak power, short pulsed Diode Pumped Solid State (DPSS) laser sources to remove a wide range of thin films from large glass, metal, or polymer substrates. A variety of wavelengths suitable for different layer materials are available, including 1064nm, 532nm, 355nm, and 266nm. These systems use advanced laser technology scribing to produce fine scribed lines with virtually no heat affected zone >30Mohm isolation. J. P. Sercel Associates (JPSA), Manchester, NH USA; ph 603/518-3200, www.jpsalaser.com.
RS photoresist dry strip cleaning system
Axcelis Technologies
Dry strip system
The RS photoresist dry strip cleaning system contains paired-chamber process modules that can run production recipes with the highest throughputs available, according to the company. The system has a multi-chamber design that allows users to run different cleaning recipes simultaneously or perform maintenance on one module while the others continue to operate. The platform includes technology required to address cleaning challenges in future technology nodes, such as those associated with advanced lithography and high- k/metal-gate adoption. Two of these systems will be shipped in Q3: one to Europe to support a 32/22nm collaborative research program, and the other to an existing memory manufacturer. Axcelis Technologies, Beverly, MA USA; ph 978/787-4000, www.axcelis.com.
SF-100 XTREME
Intelligent Micro Patterning LLC
Maskless exposure system
The SF-100 XTREME maskless exposure system provides for micropatterning of features as small as 1 micron in size. The photolithography system uses Smart Filter technology licensed by the company from the U. of South Florida. This technology incorporates micro-optical techniques to project master images directly onto diverse substrate materials. The SF-100 XTREME then adds substrate movement and an inline, confocal camera system to improve overall system results, especially when patterning fine features. Intelligent Micro Patterning LLC, St. Petersburg, FL USA; ph 727/522-0334, www.intelligentmp.com.
VK-9700 Color 3D laser
Keyence Corp.
3D laser confocal microscope
The VK-9700 Color 3D laser scanning confocal microscope combines the capabilities of SEMs and non-contact profilometry with the simplicity of a conventional microscope. Major features include a 18,000× magnification and 0.001µm 3D. The unit performs a variety of non-contact 3D measurements that include surface profile, roughness, 3D, and comparative measurements. The 3D display works with the virtual trackball method and the use of a computer mouse to control the viewing angle, lighting angle, zoom level, and Z-axis height. 3D images can be illuminated with pseudo-light when displayed on the screen. Adjusting the angle of the light in accordance with an object shades microscopic irregularities on the surface of an object. Three software programs are available for use with the VK-9700: VK-Viewer, VK-Analyzer, and VK-Assembler. An optional adjustable stand will allow the measurement of tall objects up to 100mm and a wide selection of lenses can be used based on the type of object. Also available are larger stages for wafers up to 300mm long, electric stages for automatic image assembly, and a separate measuring head that makes possible the non-destructive examination of large-sized targets. Keyence Corp. of America, Woodcliff Lake, NJ USA; ph 888/539-3623, www.keyence.com.
WaferScan 300
Tamar Technology
Infrared sensor for measuring wafers
The WaferScan 300 measures shape and thickness of wafers of all sizes, up to 300mm. The system has a modular design, allowing it to support a variety of sensors for different applications, including the company’s Optical Stylus Probe (OSP) and new IR WTS, as well as roughness measurement sensor. Measurement capabilities include thickness, TTV, LTV, shape, stress, roughness, film thickness, and X/Y dimensional measurement, and can be configured for semi- or fully automated operation. The IR based WTS measures wafer thickness from a single side with nanometer-level accuracy at a very high data rate, claims the company. The WTS can be purchased as an OEM for integration into critical process equipment or within the company’s WaferScan system for production monitoring. Tamar Technology, Newbury Park, CA USA; ph 805/480-3358, www.tamartechnology.com.
X-Series MXc
LTX Corp.
Test system
The X-Series MXc test system offers seamless compatibility with current CX systems, while providing expanded upgrade capabilities that enable deployment for an even broader range of applications. The MXc can be field-upgraded to provide increased performance and resources for wireless, RF, power, automotive, and datacomm application testing. The upgrade offers the ability to double the number of instrument slots, access higher-performance instruments, and address more complex test requirements. The X-Series MXc is fully outsource-manufactured and available immediately. LTX Corp., Norwood, MA USA; ph 781/461-1000, www.ltx.com.
eS35 e-beam
KLA-Tencor
e-beam inspection system
The eS35 e-beam inspection system is capable of detecting and classifying smaller physical defects and more subtle electrical defects at significantly higher speeds, according to the company. The unit features improved sensitivity and advances in on-board review and binning, along with substantial throughput gains. The company claims the eS35 features higher beam current density, a smaller pixel, and a faster data rate to deliver improved capture of the smallest defects at throughputs 2 to 4× than that of its predecessor, the eS32. These advances are aided by a lower noise floor and algorithms that maximize sensitivity in each region of the die, across the wafer. Via the company’s µLoop technology, the system is currently being used for 6Xnm and 5Xnm device production, 4Xnm ramp, and 3Xnm development, capturing a range of defect types on both front-end and back-end layers. The µLoop proxy provides accelerated detection of systematic defects and is suitable for logic and flash devices. KLA-Tencor, San Jose, CA USA; ph 408/875-3000, www.kla-tencor.com.
Chemraz 667
Greene, Tweed
Perfluoroelastomer improves seal The Chemraz 667 perfluoroelastomer resists O 2-based plasma and improves seal lifetime. According to the company, Chemraz 667 is softer and has lower stiction than typical compounds used in O 2 plasma, thereby improving handling and wear, especially in semi-dynamic applications. The new compound is suitable for semi-conductor fabs and equipment manufacturers facing the challenges associated with harsh plasmas. The product features low compression set qualities in temperatures up to 300°C (572°F) and increases seal integrity while at the same time reducing downtime and driving higher wafer processing yields. Greene, Tweed, Kulpsville, PA USA; www.gtweed.com.
Draeger Guardian Gas Detection System
Draegerwerk AG & Co. KGaA
Toxic gas detection systemThe Draeger Guardian Gas Detection System uses electrochemical sensor technology for detecting hazardous gas leaks, such as hydrochloric acid and vapors at low concentrations, where by–products can foul tubes, pipes, and instruments. The unit, which is considered to act as a one–to–one replacement of the common paper tape technology widely used throughout the semiconductor industry today, uses sensors, manufactured by Draeger, with an expected sensor life time of up to three years. The detector provides rolling, charted recordings of the hazardous gas concentrations over time and uses no consumable parts, tapes, or paper. Draegerwerk AG & Co. KGaA, Lübeck, Germany; www.draeger.com.
Imprio HD 2200
Molecular Imprints
Imprint lithography toolThe Imprio HD 2200 is the latest addition to the company’s family of Step and Flash Imprint Lithography (S-FIL) tools for hard-disk-drive (HDD) applications. The unit enables both development and pilot-production of patterned media applications and features precision patterning fidelity, fully automated double-sided disk patterning capability, and high throughput of 180 disks per hour. The first unit will be delivered to Hitachi Global Storage Technologies in mid-2008. Molecular Imprints, Mountain View, CA USA; www.mcapr.com.
Megamax
Wentworth Laboratories Inc.
Vertical probe cardThe Megamax vertical probe card for flip chip/bumped logic devices uses the company’s proprietary, chemically etched, and photo-defined contact technology that is scalable to specific probe requirements. Megamax contacts are designed to carry 1.2 amps of continuous current while at the same time delivering a solution for tight pitch applications down to 170 microns. High pin counts are accommodated in single, dual, or quad die offerings exceeding 16,000 contacts. Megamax enables customers to remove and insert replacement contacts without disassembly. Wentworth Laboratories Inc., Brookfield, CT USA; www.wentworthlabs.com.
PV1000
MTI Instruments Inc.
Solar cell measurement The PV1000 thickness-measurement system for the solar cell production industry addresses a critical need for solar cell manufacturers who are experiencing significant growth and need to manufacture higher quantities of solar cells for mass consumption. Each PV1000 module provides up to three pairs of probes for measurement of maximum, minimum, and average thickness, as well as total thickness variation and wafer bow. For applications that require additional thickness channels, multiple PV1000 modules can be chained together for unlimited line scans on the wafer. The system was created out of the platform for EVE, MTI’s advanced data acquisition and analysis system. MTI Instruments Inc., Albany, NY USA; www.mtiinstruments.com/.
730 series
Technical Manufacturing Corp
Optical top The 730 series vacuum-compatible optical top combines the company’s CleanTop with several new proprietary design features, special cleaning of process materials, and a vacuum pump-down procedure that keeps out-gassing to a minimum. The top features all-stainless steel construction, including the honeycomb core with its vacuum-compatible geometry. Available in a wide range of sizes and shapes, the optical top was developed with the assistance of scientists and engineers at the U. of Texas’ Petawatt Laser Project and the National Ignition Facility (NIF) at Lawrence Livermore National Laboratory. Technical Manufacturing Corp., Peabody, MA USA; www.techmfg.com.
ADXL001
Analog Devices
MEMS-based vibration sensor The ADXL001 high-bandwidth MEMS vibration sensor enables better monitoring of equipment performance. Based on the company’s iMEMS Motion Signal Processing technology, the sensor allows designers of industrial process control instruments to incorporate high-performance, dependable high-bandwidth vibration monitoring into their applications via an easy-to-use sensor solution, according to company claims. The unit is capable of early detection of motor-bearing vibration and irregularities up to 22kHz, allowing system operators to identify failing equipment long before costly damage is sustained. The new iMEMS vibration sensor is available in a 5mm×5mm ceramic package that can be designed into the motor control circuitry or mounted on existing factory equipment at the point of measurement interest. It is available in three full-scale dynamic ranges of ±70g, ±250g, and ±500g and is highly resistant to EMI and RFI. The ADXL001 is priced at $35 in 1,000-unit quantities and comes in an 8-pin LCC (leadless chip carrier) ceramic package. Analog Devices, Norwood, MA USA; www.analog.com.
Electro Plus Fusion Machine
GF Piping Systems
Fusion machineThe Electro Plus Fusion Machine, with hand-held user interface, speeds the electrofusion joining process of thermoplastic pipe and fittings and can be used with several of the company’s piping systems. These corrosion-resistant piping systems are suitable for a wide range of applications, including chemical processing facilities, school and hospital labs, pharmaceutical waste systems, semiconductor manufacturing, power plants, pulp and paper mills, corrosive waste, and other industrial applications. The machine has an operating temperature range of -10°C to 45°C and compensates automatically for ambient temperature. Input voltage requirements are 100-130V AC or 200-250V AC 60Hz AC RMS. The unit weighs 45 lbs and measures 22”×14”×10”. The design allows for use in harsh field environments, and a built-in safety feature prevents fusion cycle restart without breaking the connection. The unit comes in an integral |
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