Videocasts
SST On The Scene

2007 SEMICON WEST: SST On the Scene video interviews



Unresolved metrology issues at 45nm…challenges at 32nm…AMD goes lean

Continuing a theme echoed in several venues at SEMICON West, guests of Solid StateTechnology’s video interview program, SST On the Scene, noted a lack of consensus in resolving manufacturing challenges that face the industry even at 45nm – not just at 32nm and beyond. Two metrology challenges lacking consensus include controlling processes associated with stress-induced mobility applications, and controlling processes for high-k gate dielectrics. Looking further out to 32nm, performing the overlay measurement required for controlling dual patterning lithography is another area lacking convergence at this time. Even AMD’s proposal to the industry to collaborate on the implementation of small lot manufacturing and other lean manufacturing principles is sure to provoke heated discussion and debate among equipment suppliers and chipmakers alike.

David Gross, Director, Global Manufacturing Systems Technology, 300mm Engineering, AMD

David Gross
Director, Global Manufacturing Systems Technology, 300mm Engineering, AMD

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John Allgair, Metrology Program Manager, AMD assignee to the International SEMATECH Manufacturing Initiative (ISMI)

John Allgair
Metrology Program Manager, AMD assignee to the International SEMATECH Manufacturing Initiative (ISMI)

Windows Media (high bandwidth - 300 kbps)
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Alain Diebold, Empire Innovation Professor of Nanoscale Science, College of Nanoscale Science and Engineering, University at Albany

Alain Diebold
Empire Innovation Professor of Nanoscale Science, College of Nanoscale Science and Engineering, University at Albany

Windows Media (high bandwidth - 300 kbps)
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Ludo Deferm, VP, Business Development, IMEC

Ludo Deferm
VP, Business Development, IMEC

Windows Media (high bandwidth - 300 kbps)
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Larry Larson, Front End Associate Director, SEMATECH

Larry Larson
Front End Associate Director, SEMATECH

Windows Media (high bandwidth - 300 kbps)
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